Products / Hardware

Hummer Sputter Systems Plasma Systems Aluminum Chamber Plasma Systems Roll To Roll Plasma Systems Quartz Barrel Plasma Systems Tumbler Plasma Systems Used and Refurbished Systems

Planar Etch Scanning Electron Microscopy Sample Preparation Substrate Preclean Plasma Surface Modification for Wetability (hydrophilic)Plasma Surface Activation for Non-Wetability (hydrophobic)Photoresist Strip Wet Etch Residue Clean Ashing Etching Deflash Prior to Wire Bonding for Hybrid Circuits, Multichip Modules, Flip Chips Molecular Level Cleaning Prior to Bonding, Potting, Printing, Marking Painting Planar Magnetron Sputtering Metal Thin Film Deposition Dielectric Thin Film Deposition Photomask Descum Thin Film Research Transmission Electron Microcopy Sample Preparation Inductively Coupled Plasma Etch Downstream Plasma Etch Epoxy Bleedout Removal

Services

Refurbished Equipment Plasma and Sputter System Repair Sputter System Refurbish Plasma System Refurbish RF Power Supply Repair RF Matching Network Repair DC Power Supply Repair

Home > Applications > Deflash Prior To Wire Bonding

Deflash Prior to Wire Bonding for Hybrid Circuits, Multichip Modules and Flip Chips

Download SCE-AL 3030 PDF:

Epoxy flash, deposits to devices during the encapsulation process. This flash migrates to bonding pads and interferes with electrical continuity between bonding wire and pad during the attachment process.

Plasma is commonly used to de-flash epoxy from bonding pads, thereby ensuring a good adhesion and electrical continuity.

Authored by BusinessOnLine: Search Engine Optimization Services

Products / Hardware

Industries Served

Applications

Services

Deflash Prior to Wire Bonding for Hybrid Circuits, Multichip Modules and Flip Chips