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Planar Magnetron Sputtering

A gas plasma may form whenever gas is exposed to an electric field. If the field is sufficiently strong, a high percentage of gas atoms will surrender an electron or two and become ionized. The resultant ionized gas and liberated energetic electrons comprise the gas plasma or plasma. The ionized gas atoms have relatively little kinetic energy unless they are accelerated through an electric field. When accelerated, they will bombard a surface with sufficient force to dislodge an atom from a target material. Plasma effects sputtering process by momentum transfer of material, dislodging atoms from a target material to coat a thin film onto a material of interest. Practically any material that can be made into solid target from can be sputtered, including metals and dielectrics. Contact one of our process specialists at the systems division to help you qualify our equipment for your application.