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Microelectric
Plasma- Reactive Ion and Planar Etch
- Scanning Electron Microscopy Sample Preparation
- Transmission Electron Microcopy Sample Preparation
- Substrate Preclean
- Plasma Surface Modification for Wetability (hydrophilic)
- Photoresist Strip
- Wet Etch Residue Clean
- Deflash Prior to Wire Bonding for Hybrid Circuits, Multichip Modules, Flip Chips
- Molecular Level Cleaning Prior to Bonding, Potting, Printing, Marking, Painting
- Photomask Descum
- Epoxy Bleedout Removal
Hummer® Sputtering Applications