8.0 Sputter System - SEM Sample Preparation

• Complete package ready for coating includes; etch cathode, mechanical pump and oil, system manual
• Noble Metal Targets Available: Gold, Silver, Palladium, Gold/Palladium and Platinum
• Single cabinet design with all assemblies in the cabinetry.
• Integral dual stage, direct drive, rotary vane 3.8 cfm vacuum pump.
• Manually controlled operation in plate mode.
• Pulse mode of operation for 50% duty cycle.
• Independently controllable, 3000 volt, 30 milliamperes power supplies, three (3).
• End point by time, 1 to 14 minutes. 
• Anode and dark space shield attract heat bearing electrons away from the sample.
• Magnet deflects electrons into anode and dark space shield.
• Targets (3) 75 mm x 50 mm annulus, each.
• Safety Interlock Hardware for vacuum and high voltage.
• Automatic vent at process termination.
• Stage diameter accommodates up to 200 mm diameter substrates.
• Grain size less than 2 nanometers.
• Plus/minus 20% non-uniformity over 200 mm diameter substrates with rotation of the sample. Better uniformity for smaller substrates by varying voltage applied to sputter sources
• Chamber 300 mm diameter x 200 mm height.
• Chamber is annealed, ends are ground, polished and re-annealed.
• System is 559 mm x 508 mm x 356 mm. (w,d,h) 
• Digital display of vacuum.
• Analog display of current.
• Heat rise at the sample can be limited to 2° C. 
• OPTIONAL:
• Turbomolecular pump
• Digital Thickness Monitor, 1 to 999nm
• Gauges