Hummer 8.1 Sputter System

Hummer® 8.1 DC Sputter Systems For Metal Thin Film Coatings 

• Single cabinet design with most assemblies in the cabinetry except water chiller and mechanical pump.
• Dual stage, direct drive, rotary vane 3.8 CFM vacuum pump.
• 81 I/ps turbomolecular pump.
• Vacuum gauge to 1X10-5 Torr.
• Siemens S7-200 series, PLC based control. "Touch-Panel" control pad for setting system parameters and diagnostics.
• Password protection for process and recipes.
• Digital display of vacuum
• Digital display of power
• DC Power supply - 1500 Watt .
• Optional: End point by quartz thickness monitor, 1 to 999 nm.
• 2" diameter planar magnetron sputter source, requires 1 gpm at 30° C.
• Sputter down configuration.
• Safety Interlock Hardware for vacuum and high voltage.
• Stage diameter accommodates up to 200 mm diameter substrates.
• Stage rotation 2-RPM, on-off selector switch.
• Plus/minus 20% non-uniformity over 200 mm diameter substrates with rotation.
• Chamber 300 mm diameter x 400 mm height stainless steel cylindrical chamber.
• System footprint 535 mm x 648 mm  x 1219 mm (w,d,h).
• Optional: Heated stage to 400° C or 950° C.
• Optional: Cooled stage.
• Optional: RF biased stage.
• Optional: Water chiller/recirculator is required, quoted separately.
• Optional: Mass flow control.
• Optional: Quartz thickness monitor